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? 1997-2012 microchip technology inc. ds21189t-page 1 24aa64/24lc64/24fc64 device selection table features: ? single-supply with operation down to 1.7v for 24aa64/24fc64 devices, 2.5v for 24lc64 devices ? low-power cmos technology: - active current 3 ma, max. - standby current 1 ? a, max. ? 2-wire serial interface, i 2 c? compatible ? packages with 3 address pins are cascadable up to 8 devices ? schmitt trigger inputs for noise suppression ? output slope control to eliminate ground bounce ? 100 khz and 400 khz clock compatibility ? 1 mhz clock for fc versions ? page write time 5 ms, max. ? self-timed erase/write cycle ? 32-byte page write buffer ? hardware write-protect ? esd protection > 4,000v ? more than 1 million erase/write cycles ? data retention > 200 years ? factory programming available ? packages include 8-lead pdip, soic, soij, tssop, x-rotated tssop, msop, dfn, tdfn, 5-lead sot-23 or chip scale ? pb-free and rohs compliant ? temperature ranges: - industrial (i): -40c to +85c - automotive (e): -40c to +125c description: the microchip technology inc. 24aa64/24lc64/ 24fc64 (24xx64*) is a 64 kbit electrically erasable prom. the device is organized as a single block of 8k x 8-bit memory with a 2-wire serial interface. low- voltage design permits operation down to 1.7v, with standby and active currents of only 1 ? a and 3 ma, respectively. it has been developed for advanced, low- power applications such as personal communications or data acquisition. the 24xx64 also has a page write capability for up to 32 bytes of data. functional address lines allow up to eight devices on the same bus, for up to 512 kbits address space. the 24xx64 is available in the standard 8-pin pdip, surface mount soic, soij, tssop, dfn, tdfn and msop packages. the 24xx64 is also available in the 5-lead sot-23, and chip scale packages. block diagram package types part number v cc range max. clock frequency temp. ranges 24aa64 1.7-5.5 400 khz (1) i, e 24lc64 2.5-5.5 400 khz i, e 24fc64 1.7-5.5 1 mhz (2) i note 1: 100 khz for v cc <2.5v. 2: 400 khz for v cc <2.5v. hv eeprom array page ydec xdec sense amp. memory control logic i/o control logic i/o wp sda scl v cc v ss r/w control latches generator a2 a1 a0 a0 a1 a2 v ss v cc wp scl sda 1 2 3 4 8 7 6 5 pdip/msop/soic/soij/tssop dfn/tdfn a0 a1 a2 v ss wp scl sda v cc 8 7 6 5 1 2 3 4 sot-23 1 2 34 5 wp v cc scl v ss sda cs (chip scale) (1) 1 2 3 45 v cc wp sda scl v ss (top down view, balls not visible) note 1: available in i-temp, ?aa? only. x-rotated tssop wp v cc a0 a1 1 2 3 4 8 7 6 5 scl sda v ss a2 (x/st) 64k i 2 c? serial eeprom * 24xx64 is used in this document as a generic part number for the 24aa64/24lc64/24fc64 devices.
24aa64/24lc64/24fc64 ds21189t-page 2 ? 1997-2012 microchip technology inc. 1.0 electrical characteristics absolute maximum ratings (?) v cc ............................................................................................................................... ..............................................6.5v all inputs and outputs w.r.t. v ss ......................................................................................................... -0.3v to v cc +1.0v storage temperature ............................................................................................................ ...................-65c to +150c ambient temperature with power applied ......................................................................................... .......-40c to +125c esd protection on all pins ??????????????????????????????????????????????????????????????? ??????????????????????????????????????????????????????????????? ????????????????????????? 4kv table 1-1: dc characteristics ? notice: stresses above those listed under ?absolute maximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. exposure to maximum rating conditions for extended periods may affect device reliability. dc characteristics industrial (i): t a = -40c to +85c, v cc = +1.7v to +5.5v automotive (e): t a = -40c to +125c, v cc = +1.7v to +5.5v param. no. sym. characteristic min. typ. max. units conditions ? a0, a1, a2, wp, scl and sda pins ? ???? d1 v ih high-level input voltage 0.7 v cc ??v? d2 v il low-level input voltage ? ? 0.3 v cc 0.2 v cc v v v cc ? 2.5v v cc ? 2.5v d3 v hys hysteresis of schmitt trigger inputs (sda, scl pins) 0.05 v cc ??vv cc ? 2.5v ( note 1 ) d4 v ol low-level output voltage ? ? 0.40 v i ol = 3.0 ma @ v cc = 4.5v i ol = 2.1 ma @ v cc = 2.5v d5 i li input leakage current ??1 ? av in = v ss or v cc , wp = v ss v in = v ss or v cc , wp = v cc d6 i lo output leakage current ??1 ? av out = v ss or v cc d7 c in , c out pin capacitance (all inputs/outputs) ??10pfv cc = 5.0v ( note 1 ) t a = 25c, f clk = 1 mhz d8 i cc write operating current ?0.1 3mav cc = 5.5v, scl = 400 khz d9 i cc read ? 0.05 400 ? a d10 i ccs standby current ? ? 0.01 ? 1 5 ? a ? a industrial automotive sda = scl = v cc a0, a1, a2, wp = v ss note 1: this parameter is periodically sampled and not 100% tested. 2: typical measurements taken at room temperature.
? 1997-2012 microchip technology inc. ds21189t-page 3 24aa64/24lc64/24fc64 table 1-2: ac characteristics ac characteristics electrical characteristics: industrial (i): v cc = +1.7v to 5.5v t a = -40c to +85c automotive (e): v cc = +1.7v to 5.5v t a = -40c to 125c param. no. sym. characteristic min. max. units conditions 1f clk clock frequency ? ? ? ? 100 400 400 1000 khz 1.7v ? v cc ? 2.5v 2.5v ? v cc ? 5.5v 1.7v ? v cc ? 2.5v 24fc64 2.5v ? v cc ? 5.5v 24fc64 2t high clock high time 4000 600 600 500 ? ? ? ? ns 1.7v ? v cc ? 2.5v 2.5v ? v cc ? 5.5v 1.7v ? v cc ? 2.5v 24fc64 2.5v ? v cc ? 5.5v 24fc64 3t low clock low time 4700 1300 1300 500 ? ? ? ? ns 1.7v ? v cc ? 2.5v 2.5v ? v cc ? 5.5v 1.7v ? v cc ? 2.5v 24fc64 2.5v ? v cc ? 5.5v 24fc64 4t r sda and scl rise time ( note 1 ) ? ? ? 1000 300 300 ns 1.7v ? v cc ? 2.5v 2.5v ? v cc ? 5.5v 1.7v ? v cc ? 5.5v 24fc64 5t f sda and scl fall time ( note 1 ) ? ? 300 100 ns all except, 24fc64 1.7v ? v cc ? 5.5v 24fc64 6t hd : sta start condition hold time 4000 600 600 250 ? ? ? ? ns 1.7v ? v cc ? 2.5v 2.5v ? v cc ? 5.5v 1.7v ? v cc ? 2.5v 24fc64 2.5v ? v cc ? 5.5v 24fc64 7t su : sta start condition setup time 4700 600 600 250 ? ? ? ? ns 1.7v ? v cc ? 2.5v 2.5v ? v cc ? 5.5v 1.7v ? v cc ? 2.5v 24fc64 2.5v ? v cc ? 5.5v 24fc64 8t hd : dat data input hold time 0 ? ns ( note 2 ) 9t su : dat data input setup time 250 100 100 ? ? ? ns 1.7v ? v cc ? 2.5v 2.5v ? v cc ? 5.5v 1.7v ? v cc ? 5.5v 24fc64 10 t su : sto stop condition setup time 4000 600 600 250 ? ? ? ? ns 1.7 v ? v cc ? 2.5v 2.5 v ? v cc ? 5.5v 1.7v ? v cc ? 2.5v 24fc64 2.5 v ? v cc ? 5.5v 24fc64 11 t su : wp wp setup time 4000 600 600 ? ? ? ns 1.7v ? v cc ? 2.5v 2.5v ? v cc ? 5.5v 1.7v ? v cc ? 5.5v 24fc64 12 t hd : wp wp hold time 4700 1300 1300 ? ? ? ns 1.7v ? v cc ? 2.5v 2.5v ? v cc ? 5.5v 1.7v ? v cc ? 5.5v 24fc64 note 1: not 100% tested. c b = total capacitance of one bus line in pf. 2: as a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum 300 ns) of the falling edge of scl to avoid unintended generation of start or stop conditions. 3: the combined t sp and v hys specifications are due to new schmitt trigger inputs, which provide improved noise spike suppression. this eliminates the need for a t i specification for standard operation. 4: this parameter is not tested but ensured by characterization. for endurance estimates in a specific application, please consult the total endurance? model, which can be obtained from microchip?s web site at www.microchip.com.
24aa64/24lc64/24fc64 ds21189t-page 4 ? 1997-2012 microchip technology inc. figure 1-1: bus timing data 13 t aa output valid from clock ( note 2 ) ? ? ? ? 3500 900 900 400 ns 1.7v ? v cc ? 2.5v 2.5v ? v cc ? 5.5v 1.7v ? v cc ? 2.5v 24fc64 2.5v ? v cc ? 5.5v 24fc64 14 t buf bus free time: time the bus must be free before a new transmission can start 4700 1300 1300 500 ? ? ? ? ns 1.7v ? v cc ? 2.5v 2.5v ? v cc ? 5.5v 1.7v ? v cc ? 2.5v 24fc64 2.5v ? v cc ? 5.5v 24fc64 15 t of output fall time from v ih minimum to v il maximum c b ? 100 pf 10 + 0.1c b 250 250 ns all except, 24fc64 ( note 1 ) 24fc64 ( note 1 ) 16 t sp input filter spike suppression (sda and scl pins) ? 50 ns all except, 24fc64 ( notes 1 and 3 ) 17 t wc write cycle time (byte or page) ?5ms? 18 ? endurance 1,000,000 ? cycles page mode 25c, 5.5v ( note 4 ) ac characteristics electrical characteristics: industrial (i): v cc = +1.7v to 5.5v t a = -40c to +85c automotive (e): v cc = +1.7v to 5.5v t a = -40c to 125c param. no. sym. characteristic min. max. units conditions note 1: not 100% tested. c b = total capacitance of one bus line in pf. 2: as a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum 300 ns) of the falling edge of scl to avoid unintended generation of start or stop conditions. 3: the combined t sp and v hys specifications are due to new schmitt trigger inputs, which provide improved noise spike suppression. this eliminates the need for a t i specification for standard operation. 4: this parameter is not tested but ensured by characterization. for endurance estimates in a specific application, please consult the total endurance? model, which can be obtained from microchip?s web site at www.microchip.com. (unprotected) (protected) scl sda in sda out wp 5 7 6 16 3 2 89 13 d3 4 10 11 12 14
? 1997-2012 microchip technology inc. ds21189t-page 5 24aa64/24lc64/24fc64 2.0 pin descriptions the descriptions of the pins are listed in tab l e 2 - 1 . table 2-1: pin function table 2.1 a0, a1, a2 chip address inputs the a0, a1 and a2 inputs are used by the 24xx64 for multiple device operation. the levels on these inputs are compared with the corresponding bits in the slave address. the chip is selected if the compare is true. up to eight devices may be connected to the same bus by using different chip select bit combinations. these inputs must be connected to either v cc or v ss . in most applications, the chip address inputs a0, a1 and a2 are hard-wired to logic ? 0 ? or logic ? 1 ?. for applications in which these pins are controlled by a microcontroller or other programmable device, the chip address pins must be driven to logic ? 0 ? or logic ? 1 ? before normal device operation can proceed. address pins are not available in the sot-23 or chip scale packages. 2.2 serial data (sda) sda is a bidirectional pin used to transfer addresses and data into and out of the device. since it is an open- drain terminal, the sda bus requires a pull-up resistor to v cc (typical 10 k ? for 100 khz, 2 k ?? for 400 khz). for normal data transfer, sda is allowed to change only during scl low. changes during scl high are reserved for indicating the start and stop conditions. 2.3 serial clock (scl) the scl input is used to synchronize the data transfer from and to the device. 2.4 write-protect (wp) this pin must be connected to either v ss or v cc . if tied to v ss , write operations are enabled. if tied to v cc , write operations are inhibited but read operations are not affected. 3.0 functional description the 24xx64 supports a bidirectional, 2-wire bus and data transmission protocol. a device that sends data onto the bus is defined as transmitter, while a device receiving data is defined as a receiver. the bus has to be controlled by a master device which generates the serial clock (scl), controls the bus access and generates the start and stop conditions, while the 24xx64 works as slave. both master and slave can operate as transmitter or receiver, but the master device determines which mode is activated. name pdip soic tssop rotated tssop dfn (1) tdfn (1) msop sot-23 cs description a0 1 1 1 3 1 1 1 ? ? chip address input a1 2 2 2 4 2 2 2 ? ? chip address input a2 3 3 3 5 3 3 3 ? ? chip address input v ss 444 6444 22ground sda 5 5 5 7 5 5 5 3 5 serial address/data i/o scl 6 6 6 8 6 6 6 1 4 serial clock wp 7 7 7 1 7 7 7 5 3 write-protect input v cc 8 8 8 2 8 8 8 4 1 +1.7v to 5.5v power supply note 1: the exposed pad on the dfn/tdfn packages can be connected to v ss or left floating.
24aa64/24lc64/24fc64 ds21189t-page 6 ? 1997-2012 microchip technology inc. 4.0 bus characteristics the following bus protocol has been defined: ? data transfer may be initiated only when the bus is not busy ? during data transfer, the data line must remain stable whenever the clock line is high. changes in the data line while the clock line is high will be interpreted as a start or stop condition accordingly, the following bus conditions have been defined ( figure 4-1 ). 4.1 bus not busy (a) both data and clock lines remain high. 4.2 start data transfer (b) a high-to-low transition of the sda line while the clock (scl) is high determines a start condition. all commands must be preceded by a start condition. 4.3 stop data transfer (c) a low-to-high transition of the sda line while the clock (scl) is high determines a stop condition. all operations must be ended with a stop condition. 4.4 data valid (d) the state of the data line represents valid data when, after a start condition, the data line is stable for the duration of the high period of the clock signal. the data on the line must be changed during the low period of the clock signal. there is one clock pulse per bit of data. each data transfer is initiated with a start condition and terminated with a stop condition. the number of data bytes transferred between start and stop conditions is determined by the master device and is, theoretically, unlimited (although only the last thirty two will be stored when doing a write operation). when an overwrite does occur, it will replace data in a first-in first-out (fifo) fashion. 4.5 acknowledge each receiving device, when addressed, is obliged to generate an acknowledge after the reception of each byte. the master device must generate an extra clock pulse which is associated with this acknowledge bit. the device that acknowledges has to pull down the sda line during the acknowledge clock pulse in such a way that the sda line is stable low during the high period of the acknowledge related clock pulse. of course, setup and hold times must be taken into account. during reads, a master must signal an end of data to the slave by not generating an acknowledge bit on the last byte that has been clocked out of the slave. in this case, the slave (24xx64) will leave the data line high to enable the master to generate the stop condition. figure 4-1: data transfer sequence on the serial bus note: the 24xx64 does not generate any acknowledge bits if an internal programming cycle is in progress. scl sda (a) (b) (d) (d) (a) (c) start condition address or acknowledge valid data allowed to change stop condition
? 1997-2012 microchip technology inc. ds21189t-page 7 24aa64/24lc64/24fc64 5.0 device addressing a control byte is the first byte received following the start condition from the master device ( figure 5-1 ). the control byte consists of a four-bit control code. for the 24xx64, this is set as ? 1010 ? binary for read and write operations. the next three bits of the control byte are the chip select bits (a2, a1, a0). the chip select bits allow the use of up to eight 24xx64 devices on the same bus and are used to select which device is accessed. the chip select bits in the control byte must correspond to the logic levels on the corresponding a2, a1 and a0 pins for the device to respond. these bits are, in effect, the three most significant bits of the word address. for the sot-23 and chip scale packages, the address pins are not available. during device addressing, the a2, a1 and a0 chip select bits ( figure 5-2 ) should be set to ? 0 ?. the last bit of the control byte defines the operation to be performed. when set to a ? 1 ?, a read operation is selected. when set to a ? 0 ?, a write operation is selected. the next two bytes received define the address of the first data byte ( figure 5-2 ). because only a12...a0 are used, the upper-three address bits are ?don?t care? bits. the upper-address bits are transferred first, followed by the less significant bits. following the start condition, the 24xx64 monitors the sda bus, checking the device-type identifier being transmitted. upon receiving a ? 1010 ? code and appro- priate device-select bits, the slave device outputs an acknowledge signal on the sda line. depending on the state of the r/w bit, the 24xx64 will select a read or write operation. figure 5-1: control byte format 5.1 contiguous addressing across multiple devices the chip select bits a2, a1 and a0 can be used to expand the contiguous address space for up to 512k bits by adding up to eight 24xx64 devices on the same bus. in this case, software can use a0 of the control byte as address bit a13; a1 as address bit a14; and a2 as address bit a15. it is not possible to sequentially read across device boundaries. the sot-23 and chip scale packages do not support multiple device addressing on the same bus. figure 5-2: address sequence bit assignments 1010 a2 a1 a0 sack r/w control code chip select bits slave address acknowledge bit start bit read/write bit 1010 a 2 a 1 a 0 r/w xxx a 11 a 10 a 9 a 7 a 0 a 8 ?????? a 12 control byte address high byte address low byte control code chip select bits x = ?don?t care? bit
24aa64/24lc64/24fc64 ds21189t-page 8 ? 1997-2012 microchip technology inc. 6.0 write operations 6.1 byte write following the start condition from the master, the control code (four bits), the chip select (three bits) and the r/w bit (which is a logic low) are clocked onto the bus by the master transmitter. this indicates to the addressed slave receiver that the address high byte will follow once it has generated an acknowledge bit during the ninth clock cycle. therefore, the next byte transmit- ted by the master is the high-order byte of the word address and will be written into the address pointer of the 24xx64. the next byte is the least significant address byte. after receiving another acknowledge signal from the 24xx64, the master device will transmit the data word to be written into the addressed memory location. the 24xx64 acknowledges again and the master generates a stop condition. this initiates the internal write cycle and, during this time, the 24xx64 will not generate acknowledge signals ( figure 6-1 ). if an attempt is made to write to the array with the wp pin held high, the device will acknowledge the command, but no write cycle will occur, no data will be written and the device will immediately accept a new command. after a byte write command, the internal address coun- ter will point to the address location following the one that was just written. 6.2 page write the write control byte, word address and the first data byte are transmitted to the 24xx64 in the same way as in a byte write. however, instead of generating a stop condition, the master transmits up to 31 additional bytes which are temporarily stored in the on-chip page buffer and will be written into memory once the master has transmitted a stop condition. upon receipt of each word, the five lower address pointer bits are internally incremented by one. if the master should transmit more than 32 bytes prior to generating the stop condition, the address counter will roll over and the previously received data will be overwritten. as with the byte write operation, once the stop condition is received, an inter- nal write cycle will begin ( figure 6-2 ). if an attempt is made to write to the array with the wp pin held high, the device will acknowledge the command, but no write cycle will occur, no data will be written, and the device will immediately accept a new command. 6.3 write protection the wp pin allows the user to write-protect the entire array (0000-1fff) when the pin is tied to v cc . if tied to v ss the write protection is disabled. the wp pin is sampled at the stop bit for every write command ( figure 4-1 ). toggling the wp pin after the stop bit will have no effect on the execution of the write cycle. note: when doing a write of less than 32 bytes the data in the rest of the page is refreshed along with the data bytes being written. this will force the entire page to endure a write cycle, for this reason endurance is specified per page. note: page write operations are limited to writ- ing bytes within a single physical page, regardless of the number of bytes actually being written. physical page boundaries start at addresses that are integer multiples of the page buffer size (or ?page size?) and end at addresses that are integer multiples of [page size ? 1]. if a page write command attempts to write across a physical page boundary, the result is that the data wraps around to the beginning of the current page (overwriting data previously stored there), instead of being written to the next page, as might be expected. it is therefore necessary for the application software to prevent page write operations that would attempt to cross a page boundary.
? 1997-2012 microchip technology inc. ds21189t-page 9 24aa64/24lc64/24fc64 figure 6-1: byte write figure 6-2: page write xxx bus activity master sda line bus activity s t a r t control byte address high byte address low byte data s t o p a c k a c k a c k a c k x = ?don?t care? bit s 1010 0 a 2 a 1 a 0 p xxx bus activity master sda line bus activity s t a r t control byte address high byte address low byte data byte 0 s t o p a c k a c k a c k a c k data byte 31 a c k x = ?don?t care? bit s 1010 0 a 2 a 1 a 0 p
24aa64/24lc64/24fc64 ds21189t-page 10 ? 1997-2012 microchip technology inc. 7.0 acknowledge polling since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). once the stop condition for a write command has been issued from the master, the device initiates the internally-timed write cycle and ack polling can then be initiated immediately. this involves the master sending a start condition followed by the control byte for a write command (r/w = 0 ). if the device is still busy with the write cycle, then no ack will be returned. if no ack is returned, the start bit and control byte must be re-sent. if the cycle is complete, the device will return the ack and the master can then proceed with the next read or write command. see figure 7-1 for a flow diagram of this operation. figure 7-1: acknowledge polling flow send write command send stop condition to initiate write cycle send start send control byte with r/w = 0 did device acknowledge (ack = 0 )? next operation no yes
? 1997-2012 microchip technology inc. ds21189t-page 11 24aa64/24lc64/24fc64 8.0 read operation read operations are initiated in the same way as write operations, with the exception that the r/w bit of the control byte is set to one. there are three basic types of read operations: current address read, random read and sequential read. 8.1 current address read the 24xx64 contains an address counter that main- tains the address of the last word accessed, internally incremented by one. therefore, if the previous read access was to address ?n? (n is any legal address), the next current address read operation would access data from address n + 1 . upon receipt of the control byte with r/w bit set to one, the 24xx64 issues an acknowledge and transmits the eight-bit data word. the master will not acknowledge the transfer, but does generate a stop condition and the 24xx64 discontinues transmission ( figure 8-1 ). 8.2 random read random read operations allow the master to access any memory location in a random manner. to perform this type of read operation, the word address must first be set. this is accomplished by sending the word address to the 24xx64 as part of a write operation (r/w bit set to ? 0 ?). once the word address is sent, the master generates a start condition following the acknowledge. this terminates the write operation, but not before the internal address pointer is set. the master then issues the control byte again, but with the r/w bit set to a one. the 24xx64 will then issue an acknowl- edge and transmit the 8-bit data word. the master will not acknowledge the transfer, but does generate a stop condition, which causes the 24xx64 to discontinue transmission ( figure 8-2 ). after a random read command, the internal address coun- ter will point to the address location following the one that was just read. 8.3 sequential read sequential reads are initiated in the same way as random reads, except that once the 24xx64 transmits the first data byte, the master issues an acknowledge as opposed to the stop condition used in a random read. this acknowledge directs the 24xx64 to transmit the next sequentially-addressed 8-bit word ( figure 8-3 ). following the final byte being transmitted to the master, the master will not generate an acknowledge, but will generate a stop condition. to provide sequential reads, the 24xx64 contains an internal address pointer which is incremented by one at the completion of each operation. this address pointer allows the entire memory contents to be serially read during one opera- tion. the internal address pointer will automatically roll over from address 1fff to address 0000 if the master acknowledges the byte received from the array address 1fff. figure 8-1: current address read sp bus activity master sda line bus activity s t o p control byte data (n) a c k n o a c k s t a r t
24aa64/24lc64/24fc64 ds21189t-page 12 ? 1997-2012 microchip technology inc. figure 8-2: random read figure 8-3: sequential read xxx bus activity master sda line bus activity a c k n o a c k a c k a c k a c k s t o p s t a r t control byte address high byte address low byte control byte data byte s t a r t x = ?don?t care? bit s 1010 aaa 0 210 s 1010 aaa 1 210 p bus activity master sda line bus activity control byte data n data n + 1 data n + 2 data n + x n o a c k a c k a c k a c k a c k s t o p p
? 1997-2012 microchip technology inc. ds21189t-page 13 24aa64/24lc64/24fc64 9.0 packaging information 9.1 package marking information xxxxxxxx t/xxxnnn yyww 8-lead pdip (300 mil) example: 8-lead soic (3.90 mm) example: xxxxxxxt xxxxyyww nnn 8-lead tssop example: 24lc64 i/p 13f 0527 24lc64i sn 0527 13f xxxx tyww nnn 4lb i527 13f 8-lead msop example: 4l64i 52713f 8-lead soic (5.28 mm) example: xxxxxxxx t/xxxxxx yywwnnn 24lc64 i/sm 052713f 8-lead 2x3 dfn example: 274 527 i3 xxx yww nn 3 e 3 e 3 e xxxxxt ywwnnn
24aa64/24lc64/24fc64 ds21189t-page 14 ? 1997-2012 microchip technology inc. note: t = temperature grade (i, e) part number 1st line marking codes tssop tssop x-rotated msop dfn tdfn sot-23 i temp. e temp. i temp. e temp. i temp. e temp. 24aa64 4ab 4abx 4a64t 271 ? a71 e10 7hnn 7wnn 24lc64 4lb 4lbx 4l64t 274 275 a74 a75 7gnn 7jnn 24fc64 4fb ? 4f64t 27a ? a7a ? ? ? 5-lead chip scale xw example: 75 example: a74 527 i3 8-lead 2x3 tdfn xxx yww nn 5-lead sot-23 xxnn example: 7gnn nn 13 legend: xx...x part number or part number code t temperature (i, e) y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code (2 characters for small packages) pb-free jedec designator for matte tin (sn) note : for very small packages with no room for the pb-free jedec designator , the marking will only appear on the outer carton or reel label. note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e
? 1997-2012 microchip technology inc. ds21189t-page 15 24aa64/24lc64/24fc64 n e1 note 1 d 12 3 a a1 a2 l b1 b e e eb c
24aa64/24lc64/24fc64 ds21189t-page 16 ? 1997-2012 microchip technology inc. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
? 1997-2012 microchip technology inc. ds21189t-page 17 24aa64/24lc64/24fc64 note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
24aa64/24lc64/24fc64 ds21189t-page 18 ? 1997-2012 microchip technology inc.
? 1997-2012 microchip technology inc. ds21189t-page 19 24aa64/24lc64/24fc64 note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
24aa64/24lc64/24fc64 ds21189t-page 20 ? 1997-2012 microchip technology inc. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
? 1997-2012 microchip technology inc. ds21189t-page 21 24aa64/24lc64/24fc64 note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
24aa64/24lc64/24fc64 ds21189t-page 22 ? 1997-2012 microchip technology inc. n b e e1 d 1 2 3 e e1 a a1 a2 c l l1
? 1997-2012 microchip technology inc. ds21189t-page 23 24aa64/24lc64/24fc64 note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
24aa64/24lc64/24fc64 ds21189t-page 24 ? 1997-2012 microchip technology inc. d n e e1 note 1 12 b e c a a1 a2 l1 l
? 1997-2012 microchip technology inc. ds21189t-page 25 24aa64/24lc64/24fc64 note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
24aa64/24lc64/24fc64 ds21189t-page 26 ? 1997-2012 microchip technology inc. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
? 1997-2012 microchip technology inc. ds21189t-page 27 24aa64/24lc64/24fc64 note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
24aa64/24lc64/24fc64 ds21189t-page 28 ? 1997-2012 microchip technology inc. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
? 1997-2012 microchip technology inc. ds21189t-page 29 24aa64/24lc64/24fc64 d n e note 1 1 2 exposed pad note 1 2 1 d2 k l e2 n e b a3 a1 a note 2 bottom view top view
24aa64/24lc64/24fc64 ds21189t-page 30 ? 1997-2012 microchip technology inc. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
? 1997-2012 microchip technology inc. ds21189t-page 31 24aa64/24lc64/24fc64 note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
24aa64/24lc64/24fc64 ds21189t-page 32 ? 1997-2012 microchip technology inc. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
? 1997-2012 microchip technology inc. ds21189t-page 33 24aa64/24lc64/24fc64
24aa64/24lc64/24fc64 ds21189t-page 34 ? 1997-2012 microchip technology inc. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
? 1997-2012 microchip technology inc. ds21189t-page 35 24aa64/24lc64/24fc64 note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging please contact your local microchip representative for specific details.
24aa64/24lc64/24fc64 ds21189t-page 36 ? 1997-2012 microchip technology inc. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
? 1997-2012 microchip technology inc. ds21189t-page 37 24aa64/24lc64/24fc64 appendix a: revision history revision h (12/2003) corrections to section 1.0, electrical characteristics. revision j (04/2005) added dfn package. revision k (08/2005) revised sections 7.1 and 7.4. revision l (03/2007) added 24fc64 part; revised device selection table; revised features section; deleted rotated tssop package; revised table 1-2; revised table 7-1; revised package information; replaced package drawings; revised product id section. revision m (01/2009) updated package drawings. added 8-lead tdfn and 5-lead sot-23 packages. revision n (03/2009) added 5-lead chip scale package. revision p (03/2009) added 5-lead chip scale package diagram and land pattern. revised block diagram. revision q (06/09) revised features section; revised table 1-2, para. 18; added note to table 2-1; revised sot-23 package example. revision r (03/2010) added tssop x-rotated package; updated package drawings; updated product id. revision s (01/2012) updated package drawings: updated product id. revision t (12/2012) revised automotive e-temp; product id system.
24aa64/24lc64/24fc64 ds21189t-page 38 ? 1997-2012 microchip technology inc. notes:
? 1997-2012 microchip technology inc. ds21189t-page 39 24aa64/24lc64/24fc64 the microchip web site microchip provides online support via our www site at www.microchip.com . this web site is used as a means to make files and information easily available to customers. accessible by using your favorite internet browser, the web site contains the following information: ? product support ? data sheets and errata, application notes and sample programs, design resources, user?s guides and hardware support documents, latest software releases and archived software ? general technical support ? frequently asked questions (faq), technical support requests, online discussion groups, microchip consultant program member listing ? business of microchip ? product selector and ordering guides, latest microchip press releases, listing of seminars and events, listings of microchip sales offices, distributors and factory representatives customer change notification service microchip?s customer notification service helps keep customers current on microchip products. subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. to register, access the microchip web site at www.microchip.com . under ?support?, click on ?customer change notification? and follow the registration instructions. customer support users of microchip products can receive assistance through several channels: ? distributor or representative ? local sales office ? field application engineer (fae) ? technical support ? development systems information line customers should contact their distributor, representative or field application engineer (fae) for support. local sales offices are also available to help customers. a listing of sales offices and locations is included in the back of this document. technical support is available through the web site at: http://microchip.com/support
24aa64/24lc64/24fc64 ds21189t-page 40 ? 1997-2012 microchip technology inc. reader response it is our intention to provide you with the best documentation possible to ensure successful use of your microchip product. if you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please fax your comments to the technical publications manager at (480) 792-4150. please list the following information, and use this outline to provide us with your comments about this document. to: technical publications manager re: reader response total pages sent ________ from: name company address city / state / zip / country telephone: (_______) _________ - _________ application (optional): would you like a reply? y n device: literature number: questions: fax: (______) _________ - _________ ds21189t 24aa64/24lc64/24fc64 1. what are the best features of this document? 2. how does this document meet your hardware and software development needs? 3. do you find the organization of this document easy to follow? if not, why? 4. what additions to the document do you think would enhance the structure and subject? 5. what deletions from the document could be made without affecting the overall usefulness? 6. is there any incorrect or misleading information (what and where)? 7. how would you improve this document?
? 1997-2012 microchip technology inc. ds21189t-page41 24aa64/24lc64/24fc64 product identification system to order or obtain information, e.g. , on pricing or delivery, refer to the factory or the listed sales office. part no. x /xx package temperature range device device: 24aa64: 1.7v, 64 kbit i 2 c? serial eeprom 24aa64t: 1.7v, 64 kbit i 2 c serial eeprom (tape and reel) 24aa64x: 1.7v, 64 kbit i 2 c serial eeprom in alternate pinout (st only) 24aa64xt: 1.7v, 64 kbiti 2 c serial eeprom in alternate pinout (st only) 24lc64: 2.5v, 64 kbit i 2 c serial eeprom 24lc64t: 2.5v, 64 kbit i 2 c serial eeprom (tape and reel) 24lc64x: 2.5v, 64 kbit i 2 c serial eeprom in alternate pinout (st only) 24lc64xt: 2.5v, 64 kbit i 2 c serial eeprom in alternate pinout (st only) 24fc64: 2.5v, 64 kbit i 2 c serial eeprom 24fc64t: 2.5v, 64 kbit i 2 c serial eeprom (tape and reel) temperature range: i = -40c to +85c e = -40c to +125c package: p = plastic dip (300 mil body), 8-lead sn = plastic soic (3.90 mm body), 8-lead sm = plastic soic (5.28 mm body), 8-lead st = plastic tssop (4.4 mm), 8-lead ms = plastic msop (micro small outline), 8-lead mc = plastic dfn (2x3x0.9 mm body), 8-lead mny (1) = plastic tdfn (2x3x0.75 mm body), 8-lead ot = plastic sot-23, 5-lead (tape and reel only) cs16k (2) =chip scale (cs), 5-lead (i-temp, "aa", tape and reel only) examples: a) 24aa64-i/p: industrial temperature, 1.7v, pdip package b) 24aa64-i/sn: industrial temperature, 1.7v, soic package c) 24aa64-i/sm: industrial temperature, 1.7v, soic (5.28 mm) package d) 24aa64t-i/st: industrial temperature, 1.7v, tssop package, tape and reel e) 24lc64-i/p: industrial temperature, 2.5v, pdip package f) 24lc64-e/sn: extended temperature, 2.5v, soic package g) 24lc64-e/sm: extended temperature, 2.5v, soic (5.28 mm) package h) 24lc64-i/st: industrial temperature, 2.5v, tssop package i) 24aa64t-i/cs16k: industrial tempera- ture, 1.7v, cs package, tape and reel j) 24aa64t-e/sn: extended temperature, 1.7v, soic package, tape and reel x note 1: "y" indicates a nickel palladium gold (nipdau) finish. 2: "16k" indicates 160k technology.
24aa64/24lc64/24fc64 ds21189t-page 42 ? 1997-2012 microchip technology inc. notes:
? 1997-2012 microchip technology inc. ds21189t-page 43 information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyer?s risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, dspic, flashflex, k ee l oq , k ee l oq logo, mplab, pic, picmicro, picstart, pic 32 logo, rfpic, sst, sst logo, superflash and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. filterlab, hampshire, hi-tech c, linear active thermistor, mtp, seeval and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. analog-for-the-digital age, app lication maestro, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dspicworks, dsspeak, ecan, economonitor, fansense, hi-tide, in-circuit serial programming, icsp, mindi, miwi, mpasm, mpf, mplab certified logo, mplib, mplink, mtouch, omniscient code generation, picc, picc-18, picdem, picdem.net, pickit, pictail, real ice, rflab, select mode, sqi, serial quad i/o, total endurance, tsharc, uniwindriver, wiperlock, zena and z-scale are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchip technology incorporated in the u.s.a. gestic and ulpp are registered trademarks of microchip technology germany ii gmbh & co. & kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 1997-2012, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. isbn: 9781620767641 note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip produc ts in a manner outside the operating specif ications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchip?s code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management s ystem certified by dnv == iso/ts 16949 ==
ds21189t-page 44 ? 1997-2012 microchip technology inc. americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: http://www.microchip.com/ support web address: www.microchip.com atlanta duluth, ga tel: 678-957-9614 fax: 678-957-1455 boston westborough, ma tel: 774-760-0087 fax: 774-760-0088 chicago itasca, il tel: 630-285-0071 fax: 630-285-0075 cleveland independence, oh tel: 216-447-0464 fax: 216-447-0643 dallas addison, tx tel: 972-818-7423 fax: 972-818-2924 detroit farmington hills, mi tel: 248-538-2250 fax: 248-538-2260 indianapolis noblesville, in tel: 317-773-8323 fax: 317-773-5453 los angeles mission viejo, ca tel: 949-462-9523 fax: 949-462-9608 santa clara santa clara, ca tel: 408-961-6444 fax: 408-961-6445 toronto mississauga, ontario, canada tel: 905-673-0699 fax: 905-673-6509 asia/pacific asia pacific office suites 3707-14, 37th floor tower 6, the gateway harbour city, kowloon hong kong tel: 852-2401-1200 fax: 852-2401-3431 australia - sydney tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing tel: 86-10-8569-7000 fax: 86-10-8528-2104 china - chengdu tel: 86-28-8665-5511 fax: 86-28-8665-7889 china - chongqing tel: 86-23-8980-9588 fax: 86-23-8980-9500 china - hangzhou tel: 86-571-2819-3187 fax: 86-571-2819-3189 china - hong kong sar tel: 852-2943-5100 fax: 852-2401-3431 china - nanjing tel: 86-25-8473-2460 fax: 86-25-8473-2470 china - qingdao tel: 86-532-8502-7355 fax: 86-532-8502-7205 china - shanghai tel: 86-21-5407-5533 fax: 86-21-5407-5066 china - shenyang tel: 86-24-2334-2829 fax: 86-24-2334-2393 china - shenzhen tel: 86-755-8864-2200 fax: 86-755-8203-1760 china - wuhan tel: 86-27-5980-5300 fax: 86-27-5980-5118 china - xian tel: 86-29-8833-7252 fax: 86-29-8833-7256 china - xiamen tel: 86-592-2388138 fax: 86-592-2388130 china - zhuhai tel: 86-756-3210040 fax: 86-756-3210049 asia/pacific india - bangalore tel: 91-80-3090-4444 fax: 91-80-3090-4123 india - new delhi tel: 91-11-4160-8631 fax: 91-11-4160-8632 india - pune tel: 91-20-2566-1512 fax: 91-20-2566-1513 japan - osaka tel: 81-6-6152-7160 fax: 81-6-6152-9310 japan - tokyo tel: 81-3-6880- 3770 fax: 81-3-6880-3771 korea - daegu tel: 82-53-744-4301 fax: 82-53-744-4302 korea - seoul tel: 82-2-554-7200 fax: 82-2-558-5932 or 82-2-558-5934 malaysia - kuala lumpur tel: 60-3-6201-9857 fax: 60-3-6201-9859 malaysia - penang tel: 60-4-227-8870 fax: 60-4-227-4068 philippines - manila tel: 63-2-634-9065 fax: 63-2-634-9069 singapore tel: 65-6334-8870 fax: 65-6334-8850 taiwan - hsin chu tel: 886-3-5778-366 fax: 886-3-5770-955 taiwan - kaohsiung tel: 886-7-213-7828 fax: 886-7-330-9305 taiwan - taipei tel: 886-2-2508-8600 fax: 886-2-2508-0102 thailand - bangkok tel: 66-2-694-1351 fax: 66-2-694-1350 europe austria - wels tel: 43-7242-2244-39 fax: 43-7242-2244-393 denmark - copenhagen tel: 45-4450-2828 fax: 45-4485-2829 france - paris tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany - munich tel: 49-89-627-144-0 fax: 49-89-627-144-44 italy - milan tel: 39-0331-742611 fax: 39-0331-466781 netherlands - drunen tel: 31-416-690399 fax: 31-416-690340 spain - madrid tel: 34-91-708-08-90 fax: 34-91-708-08-91 uk - wokingham tel: 44-118-921-5869 fax: 44-118-921-5820 worldwide sales and service 11/29/12

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